Vibration Analysis of ID Slicing Process and Wafer Measurement

Abstract

ID (inner-diameter) slicing is widely used in cutting ingots currently. In this paper, the deflection (axial vibration) and vibration (radial vibration) signals in different slicing conditions of the silicon wafers were measured online and analyzed. The effects of the vibration signals on the machining accuracy and surface roughness of sliced wafers were investigated based on the measurement and analysis of the surface roughness, warpage and TTV (total thickness vibration) of the sliced wafers. The results show that the changes of surface roughness, warpage and TTV of the sliced wafers exhibit approximately consistence with the changes of the power spectrums of the acquired vibration signals in different working stage of the blade. The vibration and deflection signals can give evidence of the changes in the cutting forces and blade performance during slicing. The power spectrum of the signals is useful for monitoring the blade wear and tension condition and predicting the surface quality and machining accuracy of the sliced wafers.