Study for Laser Cladding of Ni60A on Copper Substrate by Laser-Reference-Cited by-同舟云学术

Study for Laser Cladding of Ni60A on Copper Substrate by Laser

Published:2008-10 Issue: Volume:392-394 Page:125-130
ISSN:1662-9795
Container-title:Key Engineering Materials
language:
Short-container-title:KEM

Author:

Tian Feng Jie¹,Liu Wei Jun¹,Shang Xiao Feng²,Yang Guang¹

Affiliation:

1. Chinese Academy of Science

2. Shenyang Institute of Aeronautical Engineering

Abstract

The Ni60A powder was clad on the copper by the laser through coaxial power feeding. The hardness and erosion resistance of the substrate and the cladding layer were measured and made contrasts. The morphology and the microstructures of the cladding layer were analyzed by scanning electronic microscopy as well as the microstructure of bonding interface. The contents of major elements in the bonding interface were studied by energy dispersive spectrometer. Moreover, large amount of (Cu and Ni) solid solution formed a metallurgic and tight bonding with the good dilution between the substrate and cladding layer.

Publisher

Trans Tech Publications, Ltd.

Subject

Mechanical Engineering,Mechanics of Materials,General Materials Science

Link

https://www.scientific.net/KEM.392-394.125.pdf

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