Affiliation:
1. University of Cambridge
Abstract
A description is given of a possible solution of an important practical problem in
microelectronics, namely producing a material of thermal expansion coeffiecient to equal that of
silicon.
Publisher
Trans Tech Publications, Ltd.
Subject
Mechanical Engineering,Mechanics of Materials,General Materials Science
Reference7 articles.
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4. J.A. Elliott, A. Kelly, and A.H. Windle, Recursive Packing of dense particle mixtures, J. Mater. Sci. Lett. 21 (2002), p.1249.
5. L.N. McCartney, Physically based damage models for laminated composites, Pro. Inst. Mech. Engrs. 217 (2003), Part L: J. Mater.: Design and Applns.: 163-199.
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