Study on Glass Strength at High Speed Edge Rounding for LCD

Author:

Suzuki Nobuyoshi1,Halai Tatsunoli1

Affiliation:

1. Tokyo Diamond Tool Mfg. Co

Abstract

With increasing in size of glass substrates for flat panel, both high productivity and high quality are required for its edge rounding process. In order to understand the effect of process speed on the strength of glass substrate, this study performs a profile grinding at the substrate edge with varied feed rate. The obtained glass substrate then undergoes a four-point bending to evaluate its strength. Weibull distribution is used to analyze the fracture strength of glass substrate after edge-rounding process and to correlate the removal rate with the quality of the process.

Publisher

Trans Tech Publications, Ltd.

Subject

Mechanical Engineering,Mechanics of Materials,General Materials Science

Reference7 articles.

1. H. Kobayashi: Fracture mechanics (Kyouritu Publisher, Japan 1993).

2. O. Imanaka: Handbook on Ceramics working (Nikkan Kougyou Newspaper Publisher, Japan 1987).

3. K. Ohashi: Mechanism of Fracture (Maruzen. Co., Ltd, Japan 1987).

4. H. Awaji: Strength of Ceramic Materials (Corona Publishing Co., Ltd., Japan 2001).

5. Materials Science Society of Japan: Materials and Fracture (Shokabo, Japan 1989).

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