Sic-Reinforced Aluminum-Silicon Composite via Pressureless Infiltration Using Polystyrene as External Binder for Electronic Assemblies

Abstract

SiC-reinforced aluminum composite was developed by pressureless infiltration technique using polystyrene as external binder. The metal matrix composites obtained were characterized for phase composition, microstructure, density, porosity, hardness and thermal expansion. The SiC particles were uniformly distributed within the Al-Si matrix with the help of polystyrene as external binder. The variation in the density of the composites was found to be linear with volume percent of SiC. The hardness increased with increasing SiC content and highest hardness was 64.52 HV achieved with addition of 20 vol.% SiC. Thermal conductivity of the composites increased with increasing of SiC volume fraction up to 27.34 W/mK.