Polarization Engineering of Al(Ga)N/GaN HEMT Structures for Microwave High Power Applications

Author:

Rennesson Stephanie1,Lecourt Francois2,Defrance Nicolas2,Chmielowska Magdalena1,Chenot Sébastien1,Lesecq Marie2,Hoel Virginie2,Okada Etienne2,Cordier Yvon1,de Jaeger Jean Claude2

Affiliation:

1. Centre de Recherche sur l’Hétéro-Epitaxie et ses Applications CNRS

2. IEMN-CNRS UMR 8520

Abstract

The aim of this paper is to optimize the epitaxial layer structure of an AlGaN/GaN high electron mobility transistor (HEMT) for high power density at high frequency. The idea is to play on the polarization engineering with the different layers of the epitaxial stack. The influence of the cap and barrier layer thicknesses, the aluminum content in the barrier and the insertion of an AlGaN buffer layer are studied through the electron gas density, electron mobility and sheet resistance. This permits to find out the best trade-off in order to satisfy the requirements for high performances.

Publisher

Trans Tech Publications, Ltd.

Subject

Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science

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