Growth and Characterization of Thick Multi-Layer 4H-SiC Epiwafer for Very High-Voltage p-Channel IGBTs

Author:

Miyazawa Tetsuya1,Nakayama Koji2,Tanaka Atsushi2,Asano Katsunori2,Ji Shi Yang3,Kojima Kazutoshi3,Ishida Yuuki3,Tsuchida Hidekazu1

Affiliation:

1. Central Research Institute of Electric Power Industry (CRIEPI)

2. Kansai Electric Power Co., Inc.

3. National Institute of Advanced Industrial Science and Technology

Abstract

Thick multi-layer 4H-SiC epitaxial growth was investigated for very high-voltage Si-face p-channel insulated gate bipolar transistors (p-IGBTs). The multi-layer included n+ buffer, p+ field stop, and thick p- drift layers. Two processes were employed to enhance the carrier lifetime of the p- drift layer: carbon ion implantation/annealing and hydrogen annealing, and the enhanced carrier lifetime was confirmed by the open-circuit voltage decay measurement. Using the grown thick multi-layer 4H-SiC, simple pin diodes were fabricated instead of p-IGBTs to demonstrate efficient conductivity modulation in the thick p- drift layer. While the on-state voltage was high at room temperature, it decreased significantly at elevated temperatures, and attained 3.5 V at 100 A/cm2 at 200°C for the diode with the carrier lifetime enhancement processes, indicating sufficient conductivity modulation.

Publisher

Trans Tech Publications, Ltd.

Subject

Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science

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