The Dependence of PET Layer on the Thermal Stability of PET-ITO Substrate for Mobile Electronics-Reference-Cited by-同舟云学术

The Dependence of PET Layer on the Thermal Stability of PET-ITO Substrate for Mobile Electronics

Published:2010-08 Issue: Volume:123-125 Page:503-506
ISSN:1662-8985
Container-title:Advanced Materials Research
language:
Short-container-title:AMR

Author:

Lee Hyo Soo¹,Bang Jae Oh¹,An Kyong Jun¹,Jung Seung Boo²,Chai Kyoung Hoon³

Affiliation:

1. Korea Institute of Industrial Technology

2. Sungkyunkwan University

3. LG Innotek Co. Ltd

Abstract

The PET-ITO substrate has been usually applied to many flexible applications such as selectively conducting films, flexible printed circuit, display panels, interconnections, terminals, etc., where the PET-ITO substrate has a main role to enhance the performance in the components of touch screen panels, solar cell panels and so on. Today’s flexible technology is issued on forming fine pattern, pattern alignment and mass-productivity on PET-ITO substrates, which is strongly related to thermal shrinkage and expansion of the substrate[1~5]. We investigated in this study the thermo-mechanical behavior of PET-ITO substrate using a thermo-mechanical analyzer (TMA) in order to analyze thermal strain with varying temperature.

Publisher

Trans Tech Publications, Ltd.

Subject

General Engineering

Link

https://www.scientific.net/AMR.123-125.503.pdf

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