SiC Lateral Trench JFET for Harsh-Environment Wireless Systems
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Published:2008-09
Issue:
Volume:600-603
Page:1087-1090
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ISSN:1662-9752
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Container-title:Materials Science Forum
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language:
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Short-container-title:MSF
Author:
Sankin Igor1,
Bondarenko Volodymyr1,
Sheridan David C.1,
Mazzola Michael S.2,
Casady Jeff B.1,
Fraley John3,
Schupbach Marcelo3
Affiliation:
1. TranSiC /Fairchild Semiconductor.
2. Mississippi State University
3. Arkansas Power Electronics International
Abstract
SiC Lateral Trench JFET (LTJFET) technology is demonstrated as a promising candidate
for use in high-temperature wireless telemetry systems. 4H-SiC LTJFETs were designed, fabricated
and characterized for DC, and small-signal AC and RF performance at different case temperatures.
Four-fold drain current reduction was observed at 460°C as compared to RT measurements. The
measured threshold voltage shift was less than 2.3 mV/°C from 21°C to 460°C. A simple common
source amplifier built using a fabricated device demonstrated stable small-signal AC performance
after 100 hrs of operation at 450°C. Small-signal RF measurements were carried out on the packaged
devices at different temperatures. GMax above 8 dB was measured over the L-band frequency range
at RT. The average degradation of small-signal power gain measured at f=250 MHz did not exceed
0.0125 dB/ °C over the temperature ranging from 21°C to 365°C.
Publisher
Trans Tech Publications, Ltd.
Subject
Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science
Cited by
2 articles.
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