Silicon Carbide Vertical JFET Operating at High Temperature

Author:

Vassilevski Konstantin1,Hilton Keith P.2,Wright Nicolas G.1,Uren Michael J.2,Munday A.G.2,Nikitina Irina P.1,Hydes A.J.2,Horsfall Alton B.1,Johnson C. Mark3

Affiliation:

1. Newcastle University

2. QinetiQ Ltd.

3. University of Nottingham

Abstract

Trenched and implanted vertical JFETs (TI-VJFETs) with blocking voltages of 700 V were fabricated on commercial 4H-SiC epitaxial wafers. Vertical p+-n junctions were formed by aluminium implantation in sidewalls of strip-like mesa structures. Normally-on 4H-SiC TI-VJFETs had specific on-state resistance (RO-S ) of 8 mW×cm2 measured at room temperature. These devices operated reversibly at a current density of 100 A/cm2 whilst placed on a hot stage at temperature of 500 °C and without any protective atmosphere. The change of RO-S with temperature rising from 20 to 500 °C followed a power law (~ T 2.4) which is close to the temperature dependence of electron mobility in 4H-SiC.

Publisher

Trans Tech Publications, Ltd.

Subject

Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science

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