Numerical Evaluation of Forward Voltage in SiC Pin Diode with Non-Ohmic Current Component in Contact to p-Type Layer
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Published:2008-09
Issue:
Volume:600-603
Page:1035-1038
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ISSN:1662-9752
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Container-title:Materials Science Forum
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language:
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Short-container-title:MSF
Author:
Ohtsuka Kenichi1,
Tarui Yoichiro1,
Watanabe Tomokatsu1,
Fujihira Keiko1,
Matsuno Yoshinori1
Affiliation:
1. Mitsubishi Electric Corporation
Abstract
Forward voltage of SiC pin diodes is evaluated by device simulation, where a p-type
contact is described by Schottky barrier to a p-type surface region. The contact resistance is calculated
from the comparison to I-V characteristic of Schottky structure to a p-SiC layer with a sufficiently low
Schottky barrier height. Even in the relatively low contact resistance rc of 10-4 Wcm2, non-ohmic
current component is observed in Schottky structure to p-SiC and the increase of forward voltage of
pin diodes is fairly small. Forward voltage of pin diodes increases in the pin diodes with contact
resistance rc over 10-4 Wcm2. The same behavior is also observed irrespective of a time constant of
carriers, and doping concentration and thickness of a drift layer.
Publisher
Trans Tech Publications, Ltd.
Subject
Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science
Cited by
1 articles.
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