Challenges of 4H-SiC MOSFETs on the C(000-1) Face toward the Achievement of Ultra Low On-Resistance

Author:

Fukuda Kenji1,Harada Shinsuke1,Senzaki Junji1,Okamoto Mitsuo1,Tanaka Yasunori1,Kinoshita Akimasa1,Kosugi Ryouji1,Kojima Kazu1,Kato Makoto2,Shimozato Atsushi1,Suzuki Kenji3,Hayashi Yusuke3,Takao Kazuto4,Kato Tomohisa1,Nishizawa Shin Ichi1,Yatsuo Tsutomu5,Okumura Hajime1,Ohashi Hiromichi1,Arai Kazuo1

Affiliation:

1. National Institute of Advanced Industrial Science and Technology (AIST)

2. National Institute of Advanced Industrial Science and Technology AIST

3. National Institute of Advanced Industrial Science and Technology

4. Toshiba Corporation

5. National Institute of Advanced Industrial Science and Technology, AIST

Abstract

The C(000-1) face of 4H-SiC has a lot of advantages for the power device fabrication such as the highest oxidation ratio and a smooth surface. However, the DMOS type power MOSFETs on the C(000-1) face have not been realized because of the difficulty of epitaxial growth and of high quality MOS interface formation. We have systematically investigated the device fabrication techniques for power MOSFETs on the C(000-1) face, and succeeded with the IEMOS which have blocking voltage of 660V and an on-resistance of 1.8mΩcm2 and excellent dynamic characteristics.

Publisher

Trans Tech Publications, Ltd.

Subject

Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science

Cited by 1 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献

1. Design and simulation of 3C-SiC vertical power MOSFETs;International Journal of Electronics;2020-09-13

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