Thermoelectric Properties of Bi0.5Sb1.5Te3 Prepared by the Ultrarapid Quenching Process
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Published:2009-01
Issue:
Volume:610-613
Page:394-398
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ISSN:1662-9752
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Container-title:Materials Science Forum
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language:
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Short-container-title:MSF
Author:
Wei Shao Hong1,
Chen Hui2,
Wang Zhong1,
Chu Ying1,
Zhu Lei1,
Jian Xu Yu1,
Yu Hai Jun1
Affiliation:
1. Energy Materials and Technology Research Institute
2. Affiliated Hospital of Nantong University
Abstract
P-type Bi0.5Sb1.5Te3 thermoelectric materials have been prepared by ultrarapid quenching method with various cooling rates. The microstructures of sample are very different from those prepared by normal cooling. The ultrarapid quenched material was obtained in the shape of foils, the thickness of which were found to vary in the range of 6-20 μm, which corresponds to a cooling rate of about 106 K/S. X-ray diffraction evidenced a microcrystalline structure of the expected composition with a (0015) plane. Increasing the cooling rate, the Seebeck coefficient increase, the electrical conductivity decrease and the power factor rise up to 4.4×10-3 Wm-1K-2 .The highest ZT value of 1.22 was achivedachieved for the materials with the copper roller roration speed 40 m/s in room temperarure.
Publisher
Trans Tech Publications, Ltd.
Subject
Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science