Thermal Analysis of a Bi-Metallic Chill Vent for High Pressure Die Casting

Author:

Imran Mohammad1,Dhaliwal Rajpreet1,Masood Syed H.1

Affiliation:

1. Swinburne University of Technology

Abstract

High pressure die casting (HPDC) is widely used for manufacturing aluminum parts in automotive industry. In high pressure die casting mold, chill vents are used to allow residual air and gases to exhaust out from the mold cavity. The objective of this paper is to design and develop a bi- metallic chill vent for high pressure die casting using copper alloy material having high thermal conductivity, coated with steel layer on the surface. Transient thermal analysis was carried out using ANSYS software, and temperature distribution was compared with bimetallic and tool steel chill vents. The results show a faster extraction of heat in bi-metallic chill vent than that with steel. This paper also presents the effect of varying internal diameter of cooling channel in chill vent cooling.

Publisher

Trans Tech Publications, Ltd.

Subject

Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science

Reference6 articles.

1. A. Kaye, A. Street. Die casting Metallurgy. Butterworth and co ltd. (1982).

2. A. Nouri-Borujerdi, J. A. Goldak. J. Manuf Sci. Eng., Vol-126, pp.577-581. (2004).

3. L.H. Wang. Int Jour Cast Met Res, Vol- 20, pp.191-197. (2007).

4. M. K. Imran, S.H. Masood, M. Brandt. Proc Int. Conf. Adv Manuf Auto. Paper no- OS 127, INCAMA, Tamilnadu, India. (2009).

5. M. K. Imran, S. H. Masood, M. Brandt. Proc World Cong Eng (WCE2009), Vol-1, pp.704-708, London, U.K. (2009).

Cited by 1 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献

同舟云学术

1.学者识别学者识别

2.学术分析学术分析

3.人才评估人才评估

"同舟云学术"是以全球学者为主线,采集、加工和组织学术论文而形成的新型学术文献查询和分析系统,可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容,当前同舟云学术共收录了国内外主流学术期刊6万余种,收集的期刊论文及会议论文总量共计约1.5亿篇,并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询!咨询电话:010-8811{复制后删除}0370

www.globalauthorid.com

TOP

Copyright © 2019-2024 北京同舟云网络信息技术有限公司
京公网安备11010802033243号  京ICP备18003416号-3