Fabrication of Sub-Micro Metal Tips for In-Plane Field Emission Research-Reference-Cited by-同舟云学术

Fabrication of Sub-Micro Metal Tips for In-Plane Field Emission Research

Published:2013-07 Issue: Volume:562-565 Page:28-32
ISSN:1662-9795
Container-title:Key Engineering Materials
language:
Short-container-title:KEM

Author:

Wang Li Feng¹,Han Lei¹,Tang Jie Ying¹,Song Jing¹,Huang Qin Gan¹

Affiliation:

1. Southeast University

Abstract

Fabrication of a novel in-plane field emission diode structure is presented. Sub-micro metal tips were obtained using a two-step lithography method. The Minimum width of the metal tips was less than 100nm, and the minimum spacing of 145.7nm was obtained. The I-V characters in atmospheric environment before and after the silicon etching were measured.

Publisher

Trans Tech Publications, Ltd.

Subject

Mechanical Engineering,Mechanics of Materials,General Materials Science

Link

https://www.scientific.net/KEM.562-565.28.pdf

Reference9 articles.

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