Affiliation:
1. Harbin Institute of Technology
Abstract
Chemical vapor deposition (CVD) is an effective method of preparing silicon carbide whiskers or films and chemical vapor infiltration (CVI) can be successfully used as the preparation of SiC composites. In this paper, silicon carbides whiskers were firstly deposited on substrates of RB-SiC by CVD process and then silicon carbide composites were prepared by chemical vapor infiltration in the SiC whiskers in an upright chemical vapor deposition furnace of Φ150mm×450mm with methyltrichloride silicane (MTS) as precursor gas, H2 as carrier gas and Ar as dilute gas. The morphologies of the SiC whiskers grown on RB-SiC substrate and SiC composites infiltrated in SiC whiskers were determined by scanning electron microscope (SEM), and the crystalline phase of the final deposits were confirmed with X-ray diffractometry (XRD) As a result, the curly defects of whiskers decrease with the addition of dilute gas. And by chemical vapor infiltration in SiC whiskers the, SiC composites were successfully prepared. Finally the deposits were determined as β-SiC.
Publisher
Trans Tech Publications, Ltd.
Subject
Mechanical Engineering,Mechanics of Materials,General Materials Science
Reference12 articles.
1. E. Tobin, M. B. Magida, S. J. Kishner, et al, Design, fabrication and test of a meter class reaction bonded SiC mirror blank, SPIE 2543 (1995)12-21.
2. C.J. Shih, A Ezis, Application of hot-pressed silicon carbide to large high-precision optical struc- tures, SPIE 2543 (1995) 24–37.
3. O. Citterio, S. Campana , P. Conconi, et al, X-ray optics for the WFXT telescope, SPIE 3766 (1999), 198-206.
4. Novi A, Taglioni G, Novella L, at al, Silicon carbide for mirrors by plasma enhanced chemical vapour deposition at low temperature, in: B. Warmbein(Eds), Proceedings of the 5th Inter- national Conference on Space Optics, ESA Publications Division, Noordwijk, 2004, pp.687-690.
5. R.J. Liu, C.R. Zhang, X.G. Zhou, et al, SiC coatings for mirrors prepared by low pressure chemical vapor deposition, J Mater. Sci. Lett. 22(2003) 841-843.