Affiliation:
1. Beijing University of Technology
Abstract
A 532nm Diode-Pumped green laser was used to cut glass with the Micro-Crack control. The Micro-Crack was the micron-sized round-like crack caused by laser in the glass and the line-crack around the round-like crack. This paper researched the generation of the Micro-Crack and discussed how to control it, then researched the stress field in the glass during the cutting by finite element analysis. Propose a new method about the glass cutting which had advantages of low power, low heat effect, irregular-curve cutting and slant cutting.
Publisher
Trans Tech Publications, Ltd.
Subject
Mechanical Engineering,Mechanics of Materials,General Materials Science
Reference12 articles.
1. Salman Nisar, M.A. Sheikh, Lin Li, Shakeel Safdar, The effect of material thickness, laser power and cutting speed on cut path deviation in high-power diode laser chip-free cutting of glass, Optics & Laser Technology. 42 (2010) 1022–1031.
2. R.M. Lumley, Controlled separation of brittle materials using a laser[J], Ceramic Bulletin. 1969, 48: 850-854.
3. Tonshoff HK, Ostendorf A, Kulik C, Hesener H, Haupt O, Final Glass Products in One Processing Step by the means of Laser Radiation. In: Proceedings of the 22nd International Congress on Applications of Lasers and Electro-Optics, ICALEO. Jackonville, FL, USA: Laser Institute of America; 2003, pp.71-80.
4. Tsai CH, Liou CS, Fracture mechanism of laser cutting with controlled fracture, Transactions of the ASME. Journal of Manufacturing Science and Engineering 2003; 125: 519-28.
5. Dekker JN, Zonneveld MH, Thermal Severing . The Cutting of Brittle Materials by Thermally Induced Fracture. In: Advances in Fracture Research. In: Proceedings of the 7th International Conference on Fracture. Houston, TX USA: Pergamon; 1989, pp.2825-34.