Influence of Package on Micro-Accelerometer Sensitivity

Abstract

Package is one of the key technologies for micro-accelerometer. This paper researched the influence of package on the sensitivity of self-designed piezoresistive accelerometer. Based on the designed package method, the effect of thickness and elastic modulus of die adhesive, package shell materials and signal connection wires on the sensitivity of the sensor were studied by theory analysis, simulation and experimental test. According to results, the sensitivity of micro-accelerometer would be increased with the increasing thickness of die adhesive and decreased with increasing elastic modulus and the quantity of the die adhesive; besides, compared with accelerometer packaged by ceramic shell, the sensitivity of accelerometer packaged with the stainless steel shell was much bigger; meanwhile, the output sensitivity of the sensor varied with length of signal connection wire.