Affiliation:
1. Institute of Microelectronics, Peking University
2. Peking University
3. Samsung Electron Co.
Abstract
As pitch of TSV shrinks down, mechanical characteristics of TSVs become more complicated and the heat of chip becomes a critical issue. The objective of this paper is to study thermal mechanical characteristics of ultra-fine pitch TSV. The thermal-mechanical characterization of an ultra-fine pitch chip is simulated with FEA.
Publisher
Trans Tech Publications, Ltd.
Subject
Mechanical Engineering,Mechanics of Materials,General Materials Science
Cited by
1 articles.
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