Copper Nanowires Preparation and Field Electron Emission Properties

Abstract

Copper (Cu) nanowires films are deposited on the molybdenum film-coated Al2O3 ceramic substrates by using the electron beam vapor deposition technique. The films were characterized by optical microscopy, scanning electron microscope , x-ray diffraction spectrum and energy dispersive spectrum. The surface morphology show that the Cu nanowires have excellent length-to-diameter ratio of 300, and each Cu nanowires diameter is uniform. The field electron emission measurements of Cu nanowires films were also carried out showing the turn on field as low as 2.5 V/μm and the average current density of 0.10 mA/cm2 at electric field of 10.8 V/μm were obtained from a broad uniform emission screen over 3.0 cm2.