Effect of Additives on Thermal Conductivity of Si3N4 Ceramics

Abstract

Compared with traditional ceramics, Si3N4 ceramics have the characteristics of high theoretical thermal conductivity, high thermal shock resistance, high oxidation resistance, high strength, and strong current carrying capacity. It is a potential high-speed circuit and high-power device for heat dissipation and heat dissipation. Sealing material. For applications in 5these fields, β-Si3N4 with a relatively stable structure and high thermal conductivity is an ideal material. However, β-Si3N4 powder is difficult to sinter as a raw material. Therefore, the prepared Si3N4 generally has a low density, and there are various defects in the crystal. The existence of these defects will cause interference and scattering of heat in the transfer process. Limits the application of β-Si3N4 ceramics. Studies have shown that the introduction of different additives can form a liquid phase at high temperatures, which can effectively reduce the firing temperature of the sample and increase the density. At the same time, it can also remove lattice oxygen, weaken the intercrystalline phase, and promote the α→β phase transition. Thereby improving the thermal conductivity and sintering performance of Si3N4 ceramics. Therefore, this article reviews the types of additives and their effects on the properties of Si3N4 ceramics and their mechanism. Trying to find an additive system for the preparation of high thermal conductivity Si3N4 ceramics with excellent comprehensive performance, hoping to provide help for the work and researchers engaged in the research on the thermal conductivity of Si3N4 ceramics.