Abstract
High volume fraction SiC/Al composite material, with its excellent thermal properties and flexible preparation process, has been widely used in the field of electronic packaging. In the paprer, the development of SiC/Al materials for electronic packaging and their preparation methods are reviewed. The preparation processes for preparing SiC/Al by liquid infiltration are mainly introduced. The advantages and disadvantages of several important processes are analyzed. Finally, the development trend of SiC/Al for electronic packaging prepared by liquid infiltration is prospected.
Publisher
Trans Tech Publications, Ltd.
Subject
Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science
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