Investigation of Ni/Al/Ti Ohmic Contact on N-Type 4H-SiC
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Published:2021-09-06
Issue:
Volume:1045
Page:186-193
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ISSN:1662-9752
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Container-title:Materials Science Forum
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language:
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Short-container-title:MSF
Author:
Xue Meng Qian1, Wan Cai Ping2, Ge Nian Nian2, Xu Heng Yu2
Affiliation:
1. University of Chinese Academy of Sciences 2. Chinese Academy of Sciences
Abstract
In order to understand the contribution of various metals in the formation of ohmic contacts, Ni/Al/Ti ohmic contacts on n-type 4H-SiC in terms of a different annealing temperature and Ti composition are investigated, which is more difficult to form than p-type ohmic contact. The formation of the Ni/Al/Ti metal alloy system is much more sensitive to metal composition than annealing conditions. With the increase of metal composition, the contact with a high Ti content yields a lower specific contact resistivity compared with the low Ti contact. The annealed surface morphology and phase resultants were examined by scanning electron microscopy (SEM) and atomic force microscope (AFM), respectively. With the increase of Ti components, the surface morphology of the samples becomes more uniform and smoother, while the surface roughness remains unchanged. It implies that Ti metal can not only reduce the ohmic resistance, but also protect the surface of the sample and maintain the roughness.
Publisher
Trans Tech Publications, Ltd.
Subject
Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science
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