Affiliation:
1. Indian Space Research Organization (ISRO)
Abstract
In space applications, day by day, the electronic devices are becoming compact with increase in operating frequencies and high power requirements posing challenges in design and selection of materials for high thermal dissipation requirements. In order to achieve optimum performance from thermal management material, engineers have to focus on high reliable, cost effective alternatives. Such materials need to demonstrate excellent thermal conduction to minimize thermo-mechanical stress and fatigue due to operations like soldering, thermal cycling and severe operating conditions. The paper describes a new family of thermal management composite material called “SILVAR”.
Publisher
Trans Tech Publications, Ltd.
Subject
Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science
Reference6 articles.
1. E.R. Tagore, Ashish Upadhyay and A.V. Pathak, Processing of Silvar for MIC package Applications,. IEEE transactions on electronics packaging manufacturing, Vol-31, No.: 3, July (2008).
2. Vishwa Shukla and Wray Johnson, Development of New Metal metrix composite materials Silvar and Cuvar for Electronic packaging". International Conference on "Emerging microelectronics and interconnection technologies, February (1996).
3. ASTM-B-925-2008 Production and preparation of Powder Metallurgy [P/M] Test specimens.
4. ASTM-E-595-2007 Total mass loss and collected volatile condensable materials from outgassing vacuum environment.
5. ASTM-E-8-2009 Test methods of Tensile Testing of metallic materials.