Affiliation:
1. Saitama Institute of Technology
Abstract
This paper is mainly a study the diffusion bonding of Mg-AZ31/Al-6061 by using the direct bonding method. After bonding process, multilayer field with Mg-Zn and Al-Zn have been confirmed by EPMA determination. Through the microstructure observed by SEM, bonding boundaries of Mg-AZ31/Al-6061 had good diffusion formation. The identification of the component on near interface was measured by XRD method. By using of these results, the mechanism of the magnesium alloy and aluminum alloys was discussed.
Publisher
Trans Tech Publications, Ltd.
Subject
Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science
Reference3 articles.
1. N. Kazumasa, M. Hirohisa, M. Hidehiko: Diffusion Bonding of Tungsten to Titanium, Quarterly Journal of the Japan Welding Society, 19-1(2001), 85-91.
2. W. Hao, D. Y. Ju, H. Kobayashi, T. Mitamura: Proc of the International Conference on Advanced Materials Development and Performance Evaluation and Application, (1999), 818-23.
3. O. Osamu, M. Keiichiro, W. Takehiko: Diffusion Bonding of Tungsten to Copper, Quarterly Journal of the Japan Welding Society, 16-3(1998), 319-323.