Microstructural and Mechanical Properties Changes of Silicon Nitride Based Ceramic Using Post-Sintering Heat Treatment

Author:

Souza José Vitor C.1,Silva O.M.M.2,Raymundo E.A.3,Machado João Paulo Barros4

Affiliation:

1. Instituto Nacional de Pesquisas Espaciais-INPE

2. CTA-IAE/AMR

3. UNIFOA

4. National Institute for Space Research – INPE

Abstract

Si3N4based ceramics are widely researched because of their low density, high hardness, toughness and wear resistance. Post-sintering heat treatments can enhance their properties. Thus, the objective of the present paper was the development of a Si3N4based ceramic, suitable for structural applications, by sintering in nitrogen gas pressure, using AlN, Al2O3, and Y2O3as additives and post-sintering heat treatment. The green bodies were fabricated by uniaxial pressing at 80 MPa with subsequent isostatic pressing at 300 MPa. The samples were sintered at 1900°C for 1 h under N2gas pressure of 0.1 MPa. Post-sintering heat treatment was performed at 1500°C for 48 h under N2gas pressure of 1.0 MPa. From the results, it was observed that after post-sintering heat treatment there was a reduction of α-SiAlON phase and increase of β-Si3N4phase, with consequent changing in grain size, decrease of fracture toughness and increase of the Vickers hardness.

Publisher

Trans Tech Publications, Ltd.

Subject

Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science

Reference19 articles.

1. J.V.C. Souza, C. Santos, C.A. Kelly O.M.M. Silva: International Journal of Refractory Metals and Hard Materials Vol. 25 (2007) p.77.

2. J.J.M. Martínez and A.R. Domínguez: Progress in Materials Science 49 (2004), p.19.

3. C. Santos, S. Ribeiro, K. Strecker, and L.E.G. Silva: Acta Microscópica Vol. 12, (2003), p.83.

4. J.V.C. Souza, M.C.A. Nono, M.V. Ribeiro, O.M.M. Silva, F.C.L. Melo Materiais cerâmicos: uma tecnologia viabilizadora nos processos de usinagem. In: Feira e Congresso Usinagem 2008, São Paulo, (2008).

5. F.L. Riley: Journal of American Ceramic Society 83 (2) (2000), p.245.

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