NiTi Splat Features during Vacuum Thermal Spraying onto Several Substrates

Author:

Cinca Nuria1,Isalgué Antonio2,Fernández Javier1,Sampath S.3

Affiliation:

1. Universitat de Barcelona

2. Polytechnic University of Catalonia (UPC)

3. Center for Thermal Spray Research

Abstract

Vacuum Plasma Spraying has been used to produce coatings onto steel substrates. This work deals with the study of splat morphology of the NiTi alloy sprayed by VPS onto different substrates (aluminium, copper, stainless steel, glass and alumina). All the previous characteristics are discussed in terms of wettability and thermal conductivities regarding the rapid cooling involved in the process. Although identical conditions were used during thermal spraying, a wide variety of splat formations were observed; commonly, slushy or splash/disc splats are formed depending on whether the particles have partially or fully melted. The thermal effusivity of the substrate material, which is a measure of its ability to exchange thermal energy with its surroundings, seems to play an important role promoting more or less spreading. The higher the thermal effusivity is, the more rapidly the splats are cooled, thus starting the solidification before they come to rest and, changing their morphology.

Publisher

Trans Tech Publications, Ltd.

Subject

Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science

Reference17 articles.

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2. K. Ho, G. P. Carman, Sputter deposition of NiTi thin film shape memory alloy using a heated target, Thin Solid Films 370 (2000) 18-29.

3. Y. Q. Yang, H. S. Jia, Z. F. Zhang, H. M. Shen, A. Hu, Y. N. Wang, Mater Letters 22 (1995) 137-140.

4. K. Halter, A. Sickinger, S. Siegmann, L. Zysset, SMST-2003: The International Conference on Shape Memory and Superelastic Technologies; USA; (2004) pp.163-172.

5. K. Halter, A. Sickinger, L. Zysset, S. Siegmann, Low pressure wire arc and vacuum plasma spraying of NiTi shape memory alloys, Thermal Spray 2003: Advancing the Science & Applying the Technology. Ed. C. Moreau and B. Marple. Ohio USA, 589-595.

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