Mechanisms of Dynamic Recrystallization in Coarse Columnar-Grained Cu-Sn-P Alloy

Abstract

Dynamic recrystallization (DRX) behavior in a coarse columnar-grained Cu-0.65Sn-0.025P and Cu-0.025P (mass%) alloys were systematically investigated by compression tests at temperatures between 1073 K and 1253 K and at true strain rates from 2 x 10-4s-1to 2 x 10-1s-1in vacuum. As a model sample, an orientation-controlled bicrystal having [0 1 twist 18oboundary was prepared and also hot deformed. Appearance of the peaks stress, where DRX onsets, was much delayed in Cu-Sn-P alloy compared with that in Cu-0.025P alloy. The onset of DRX was, therefore, obviously impeded by the small addition of Sn to Cu-P. While nucleation of new grains took place almost at random in Cu-Sn-P when strain rate was high enough, it tended to appear more preferentially at grain boundary with decreasing strain rate and with increasing temperature. The most of new grains were annealing twins formed behind the migrating grain boundary. Because grain boundary migration took place more extensively with increasing temperature and with decreasing strain rate, the preferential nucleation at grain boundary became more significant.