Experimental Demonstration of 1200V SiC-SBDs with Lower Forward Voltage Drop at High Temperature

Author:

Tsuji Takashi1,Kinoshita Akimasa2,Iwamuro Noriyuki2,Fukuda Kenji2,Tezuka Kazuo3,Tsuyuki Tatsuro3,Kimura Hiroshi4

Affiliation:

1. National Institute of Advanced Industrial Science and Technology

2. National Institute of Advanced Industrial Science and Technology (AIST)

3. ULVAC Inc.

4. Fuji Electric Advanced Technology Co., Ltd.

Abstract

The 1200V class silicon carbide Schottky barrier diodes were designed and fabricated. The drift layer resistance was reduced in order to realize low forward voltage drops. Since the low drift layer resistance led to the low breakdown voltage, the avalanche withstanding capability should be enhanced not to cause the destructive breakdown. By means of the optimized device design, we succeeded to realize the low forward voltage drop while maintaining the high avalanche withstanding capability. The forward voltage drops at 200A/cm2 were 1.35V at 25°C and 1.63V at 175°C, respectively. The avalanche withstanding capability was more than 3500mJ/cm2 at 25°C. By substituting SiC-SBDs for Si-pin diodes, the estimated total power loss of the module comprised by Si-IGBTs and the diodes was reduced by 35%. We could also confirm that no failures happened after long term reliability tests.

Publisher

Trans Tech Publications, Ltd.

Subject

Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science

Cited by 3 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献

1. SiC and GaN Power Devices;More-than-Moore Devices and Integration for Semiconductors;2023

2. Characterization of a 3.3-kV Si-SiC Hybrid Power Module in Half-Bridge Topology for Traction Inverter Application;IEEE Transactions on Power Electronics;2020-12

3. SiC power device design and fabrication;Wide Bandgap Semiconductor Power Devices;2019

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