Study of V and Y Shape Frank-Type Stacking Faults Formation in 4H-SiC Epilayer

Author:

Wang Huan Huan1,Wu Fang Zhen1,Byrapa Sha Yan1,Yang Yu1,Raghothamachar Balaji1,Dudley Michael1,Chung Gil Y.2,Zhang Jie2,Thomas Bernd2,Sanchez Edward K.3,Mueller Stephan G.2,Hansen Darren M.2,Loboda Mark J.2

Affiliation:

1. Stony Brook University

2. Dow Corning Corporation

3. Dow Corning Compound Semiconductor Solutions

Abstract

Nomarski optical microscopic, KOH etching and synchrotron topographic studies are presented of faint needle-like surface morphological features in 4H-SiC homoepitaxial layers. Grazing incidence synchrotron white beam x-ray topographs show V shaped features which transmission topographs reveal to enclose 1/4[0001] Frank-type stacking faults. Some of these V-shaped features have a tail associated with them and are referred to as Y-shaped defects. Geometric analysis of the size and shape of the V-shaped faults indicates that they are fully contained within the epilayer and appear to be nucleated at the substrate/epilayer interface. Detailed analysis shows that the positions of the V-shaped stacking faults match with the positions of c-axis threading dislocations with Burgers vectors of c or c+a in the substrate and thus appear to result from the deflection of these dislocations onto the basal plane during epilayer growth. Similarly, the Y-shaped defects match well with the substrate surface intersections of c-axis threading dislocations with Burgers vectors of c or c+a in the substrate which were deflected onto the basal plane during substrate growth. Based on the observed morphology of these defect configurations we propose a model for their formation mechanism.

Publisher

Trans Tech Publications, Ltd.

Subject

Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science

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