Attached FBG Strain Sensor Based on Thermal Stress Mechanism

Author:

Li Jian Zhi1,Du Yan Liang2,Liu C.X.1

Affiliation:

1. Shijiazhuang Tiedao University,

2. Shijiazhuang Tiedao University

Abstract

Based on a novel thermal stress mechanism, a attached FBG strain sensor with temperature-compensated function was designed and manufactured. This sensor cannot only compensate temperature drift but enhance stain sensitivity. The results are as follows: this package was shown to have a near 2.0 pm/°C shift and a high strain sensitivity of 1.9pm/με in this proposed self-compensated package.

Publisher

Trans Tech Publications, Ltd.

Subject

General Engineering

Reference9 articles.

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3. G.W. Yoffe, P.A. Krug, F. Ouellette: Applied Optics, Vol. 34(1995) , p.6859.

4. L. Yuan: Opt. Eng. Vol. 40 (2001), p.698.

5. J.J. Pan, P Ma, and Y Shi, in: Proc. Nat. Fiber Opt. Eng. Conf., San Diego, CA (1997).

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