Effect of Input Power on the Deposition of Optical Grade Thick Diamond Film in a DCPJ CVD Jet System-Reference-Cited by-同舟云学术

Effect of Input Power on the Deposition of Optical Grade Thick Diamond Film in a DCPJ CVD Jet System

Published:2010-01 Issue: Volume:426-427 Page:245-248
ISSN:1662-9795
Container-title:Key Engineering Materials
language:
Short-container-title:KEM

Author:

Chen Rong Fa¹,Shen Zhao Xia²,Dai Liang Gang²,Zhang Xian Liang²,Zhu Rui²,Zuo Dun Wen³

Affiliation:

1. Yang Zhou University

2. Yangzhou University

3. Nanjing University of Aeronautics and Astronautics

Abstract

High quality optical grade thick diamond film wafers with different thickness are prepared by high power DC arc plasma jet CVD (DCPJ CVD) method using a CH4/Ar/H2 gas mixture. Three different powers, 13.65, 15.40 and 17.94kW, were employed during the investigation. The aim was to investigate the effect of these powers on the deposition of thick diamond film. The controlled system was discussed together. The results show that the average diamond grain size and growth rate increase with input plasma power, but a further increase in input power, diamond thick-film defects and amorphous carbon content increased.

Publisher

Trans Tech Publications, Ltd.

Subject

Mechanical Engineering,Mechanics of Materials,General Materials Science

Link

https://www.scientific.net/KEM.426-427.245.pdf

Reference15 articles.

1. D. W. Zuo, S.L. Song et al: Key Engineering Material Vol. 258-259 (2004), p.517.

2. G.H. Li, F.X. Lu et al : Chinese Patent CN1099547A.

3. T.B. Huang, J.M. Liu, et al: Journal of University of Science and Technology Vol. 22 (2000) No. 5, p.467.

4. S.L. Song, D.W. Zuo et al: Journal of Applied Science Vol. 21 (2003) No. 4, p.423.

5. H.Q. Li, G.F. Zhong et al: Journal of University of Science and Technology Vol. 16 (1994) No. 6, p.547.

Cited by 1 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. The Development of Manufacturing Technology of CVD Diamond Thick Film Tools;IOP Conference Series: Materials Science and Engineering;2019-08-01