Fatigue Testing of Thin Films-Reference-Cited by-同舟云学术

Fatigue Testing of Thin Films

Published:2011-01 Issue: Volume:465 Page:552-555
ISSN:1662-9795
Container-title:Key Engineering Materials
language:
Short-container-title:KEM

Author:

Burger Sofie¹,Rupp Benjamin²,Ludwig Alfred³,Kraft Oliver¹,Eberl Christoph⁴

Affiliation:

1. Karlsruher Institut für Technologie

2. University of Kentucky

3. Ruhr Universität Bochum

4. Karlsruhe Institute of Technology

Abstract

Thin film processing has been a driving technology in microelectronics and mechanics for years. The reliability of such devices is often limited by the failure of thin films. Therefore a deeper understanding of fatigue mechanisms of thin films through experiments is necessary to develop physical based lifetime models. Thus, this paper focuses on a novel setup for micro beam bending of thin metal films on Si cantilever substrate and first results will be presented.

Publisher

Trans Tech Publications, Ltd.

Subject

Mechanical Engineering,Mechanics of Materials,General Materials Science

Link

https://www.scientific.net/KEM.465.552.pdf

Reference4 articles.

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2. R. Schwaiger and O. Kraft: Acta Materialia, 51(1): 195–206, (2003).

3. GP Zhang, CA Volkert, R Schwaiger, P Wellner, E Arzt, and O Kraft: Acta Materialia, 54(11): 3127–3139, June (2006).

4. A. Ludwig, J. Cao, A. Savan, M. Ehmann: Journal of Alloys and Compounds, 446-447, 516-521 (2007).

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