Comparison of 4H-SiC pn, Pinch and Schottky Diodes for the 3 kV Range
Author:
Affiliation:
1. SiCED Electronics Development
2. Infineon Technologies AG
3. SiCED Electronics Development GmbH & Co. KG
Publisher
Trans Tech Publications, Ltd.
Subject
Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science
Link
https://www.scientific.net/MSF.389-393.1125.pdf
Cited by 14 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献
1. Monolithically Integrated 4H-SiC MOSFET and JBS Diode (JBSFET) Using a Single Ohmic/Schottky Process Scheme;IEEE Electron Device Letters;2016-12
2. Promise and Challenges of High-Voltage SiC Bipolar Power Devices;Energies;2016-11-03
3. (Invited) Progress in Buried Grid Technology for Improvements in on-Resistance of High Voltage SiC Devices;ECS Transactions;2016-08-23
4. Temperature-Dependent Characteristics of 4H-SiC Buried Grid JBS Diodes;Materials Science Forum;2015-06
5. Evaluation of Buried Grid JBS Diodes;Materials Science Forum;2014-02
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