Effect of Injection Molding Process on Electrical Conductivity and Mechanical Property of Nanoparticle Filled Polymer Composites

Author:

Zou Jing Chao1,Jiang Ai Yun1,Zhang Bao Feng1,Wu Hai Hong2,Zhou Ya Jun1

Affiliation:

1. Huanghe Science and Technology College

2. Henan University of Technology

Abstract

Authors investigated the relationship among processing parameters, microstructures, electrical conductivity and mechanical property of injection molded nanoparticle filled polymer composites at present study. Standard tensile specimens were injected under different injecting pressures and packing pressures. The molded specimens were removing five layers from the surface to observe the microstructures at different positions of the moldings. The electrical properties were measured with a two-terminal standard resistor under DC condition at room temperature, and the mechanical properties of the moldings were measured by INSTRON 5580 Universal testing machine. The results showed that filled nanoparticles may form the best conductive path under the higher packing pressure matched with higher injection pressure. The mechanical properties of the molding depend on not only the concentration of the nanofiller, but processing conditions as well.

Publisher

Trans Tech Publications, Ltd.

Subject

General Engineering

同舟云学术

1.学者识别学者识别

2.学术分析学术分析

3.人才评估人才评估

"同舟云学术"是以全球学者为主线,采集、加工和组织学术论文而形成的新型学术文献查询和分析系统,可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容,当前同舟云学术共收录了国内外主流学术期刊6万余种,收集的期刊论文及会议论文总量共计约1.5亿篇,并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询!咨询电话:010-8811{复制后删除}0370

www.globalauthorid.com

TOP

Copyright © 2019-2024 北京同舟云网络信息技术有限公司
京公网安备11010802033243号  京ICP备18003416号-3