Study on Polishing Technology of GaAs Wafer

Abstract

GaAs are one of the most important semiconductor followed silicon, GaAs wafers are the mostly used substrates for fabricating integrated circuits (ICs). So the quality of ICs depends directly on the quality of GaAs wafers. A series of processes are required to manufacture high quality GaAs wafers. This paper reviews the literature on polishing technology of GaAs wafers, covering the history, summarizes the effects of slurry’s chemical and physical characters such as pH, oxidants, abrasive grit, velocity, and temperature in the polishing process. It also discusses some possible topics for future research.