Affiliation:
1. Shanghai Jiao Tong University
Abstract
Microscale polyurethane modified epoxy resin film has been fabricated using MEMS tehnologies in the present paper. The effect of different process conditions on the thickness of fabricated film was discussed. The microscale film shows smooth and uniform surface morphology. The tensile test of the film by DMA indicates its tensile strength and Young's modulus are approximately 55MPa and 1.8GPa, respectively. The fracture section of the film was characterized by SEM. In addition, the interface bonding strength of the fabricated film between Ni substrate is much higher than Parylene-C and SU-8. This microscale polymer film is promising in several smart MEMS fields, especially bio-MEMS structures.
Publisher
Trans Tech Publications, Ltd.
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