Affiliation:
1. Changchun University of Technology
Abstract
Through to the research of technological parameter of copper plating on the surface CF, determining the best parameters: electroplating current is 200 mA, electroplating time is 1 h. Using vacuum hot-pressing sintering to make different composition sample, the sample organization been done the SEM microscopic analysis, and measured micro-hardness and density. Then doing comparative analysis. In the matrix, CF was found to be homogeneously dispersed into the metal matrix, increasing the density of the sample.
Publisher
Trans Tech Publications, Ltd.
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