Air Damping Effects of MEMS Parallel-Plate Structure Using ANSYS Thin Film Analysis-Reference-Cited by-同舟云学术

Air Damping Effects of MEMS Parallel-Plate Structure Using ANSYS Thin Film Analysis

Published:2011-11 Issue: Volume:403-408 Page:4588-4592
ISSN:1662-8985
Container-title:Advanced Materials Research
language:
Short-container-title:AMR

Author:

Zhang Xiong Xing¹,Peng Shou Jun¹,Zou Jin Long²

Affiliation:

1. Micro-Optoelectronic Systems Labs Xi'an Technological University, Xi'an, China

2. Science and Technology on Electromechanical Dynamic Control Laboratory Xi’an Institute of Electromechanical Information Technology, Xi'an, China

Abstract

ANSYS thin film analysis was adopted to simulate the effects of squeeze film damping. The relation of damping effects versus operating frequency, velocity, material accommodation factor was analyzed, and the gas squeeze film damping and pressure distribution was simulated by steady-state analysis or harmonic analysis. Moreover, pressure distribution of damping effect in plate gap both with perforated holes and without holes, were determined and compared. Simulation results show that operating frequency and the structure of microstructures are the main influencing factors to air damping and perforated holes in plate gap can control stiffness coefficients of squeezed film damping.

Publisher

Trans Tech Publications, Ltd.

Subject

General Engineering

Link

https://www.scientific.net/AMR.403-408.4588.pdf

Reference8 articles.

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3. J.B. Starr. Squeeze-Film damping in Solid-State Accelerometers. Solid-State Sensor and Actuator Workshop, 1990, pp.44-47.

4. Feixia P, Joel K, Eric P, et al. Squeeze Film Damping Effect on the Dynamic Response of a MEMS Torsion Mirror [J]. Journal of Micromechanics and Microengineering, 1998, 8(3): 200-208.

5. Satish Vemuri. Behavioral Modeling of Viscous Damping in MEMS [D]. Pennsylvania: Carnegie Mellon Univeristy. (2000).

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