The Adhesion Testing and Analysis for NiCr/NiSi Thin-Film Sensor

Abstract

By the method of orthogonal experiment, with different sputtering power, sputtering pressure, sputtering time and substrate bias, 9 NiCr-NiSi thin-film thermocouples with different properties were prepared on the rake face of different cutting tools. With WS-2005 coating adhesion automatic scratch tester, the adhesion between the thin-film and the cutting tools were tested, and the test results was analyzed by range analysis. Analysis results show that, among four sputtering factors, substrate bias is the most important factor which influenced the thin-film adhesion. In a certain range, increasing the substrate negative bias voltage value can enhance the adhesion of thin-film. Subsequently, the range analysis result was verified by test. The best set of parameters was selected among all of the orthogonal test results, with other parameters unchanged except substrate negative bias, which was increased to -110V.And that, the adhesion value of NiCr and NiSi film was increased by 3.2N and 1.5N around individually.