Abstract
By analyzing the crucial structure of digital microphone , it has character of welding and bonding technology, in order to increase reliability of PCB connecting , especially reliability of PCB for IC bonding with chip connecting , ENEPIG PCB is leaded in , and achieve the high reliability connecting . And according to the demand of bonding technology , bonding temperature, bonding machine pressure, bonding power and bonding time are elected , a series of bonding experiments have been done , obtain some related experiment data of bonding point and analyze the data , obtained the plating thickness parameter of matching with ENEPIG PCB .
Publisher
Trans Tech Publications, Ltd.