Development and Characterization of Novel Fore Safe Epoxy Resins

Author:

Brzozowski Zbigniew K., ,Staszczak Sylwia,Koziol Pawel,Zatorski Wojciech,Bogdal Dariusz, , , , ,

Abstract

The curing system for newly developed solid state fire safe epoxy resins using dicyandiamide (DICY) was introduced. Composites of epoxy resins obtained from diglycidyl ether of 1,1-dichloro-2,2bis(4-hydroxyphenyl)ethylene bisphenol-C (BPC) and bisphenol-A (BPA) epoxy resins in the reaction with BPC and BPA and DICY hardener were studied. Solid epoxy resins were synthesised by the use of two different heating methods: conventional and microwave reactor. The quantities of DICY additions were 0.5–5.0 %, optimum was found to be 3 %. Limited oxygen index (OI) tests for different epoxy resins and addition of flame – retardants were carried out. The highest value of OI was 34.6. As additional flame-retardants were used zinc stannates (ZS, ZHS). Evident OI increase was noted from 27.0 for classical epoxies, 34.6 for BPC cured epoxies and 44 for cured composites with the addition of Zn/Sn flame-retardants.

Publisher

Lviv Polytechnic National University

Subject

General Chemical Engineering,General Chemistry

Reference23 articles.

1. [1] Lyon R.: Ultra fire-resistant thermoset polymers. Fire Research Program, Federal Aviation Administration, Technical Center Atlantic City International Airport, NJ 08405, 2005.

2. [2] Brzozowski Z.: Polimery, 1986, 31, 99.

3. [3] Brzozowski Z.: Assistant professor theses, Warsaw University of Technology, 1986.

4. [4] Brzozowski Z. and Porejko S.: Polish pat. 47 344, Publ. Dec. 15, 1964.

5. [5] Brzozowski Z. and Porejko S.: Pat. UK 1 051 335, Publ. July 26, 1963.

同舟云学术

1.学者识别学者识别

2.学术分析学术分析

3.人才评估人才评估

"同舟云学术"是以全球学者为主线,采集、加工和组织学术论文而形成的新型学术文献查询和分析系统,可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容,当前同舟云学术共收录了国内外主流学术期刊6万余种,收集的期刊论文及会议论文总量共计约1.5亿篇,并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询!咨询电话:010-8811{复制后删除}0370

www.globalauthorid.com

TOP

Copyright © 2019-2024 北京同舟云网络信息技术有限公司
京公网安备11010802033243号  京ICP备18003416号-3