Author:
Lisenkov V.Yu.,Kaziev A.V.,Ageychenkov D.G.,Tumarkin A.V.,Kolodko D.V.,Kharkov M.M.,Kukushkina M.S.,Zaripova M.M.
Abstract
Copper oxide thin films are widely used in many fields, such as solar cells, optoelectronics, catalysis, biosensors, photoelectrochemical sensors, supercapacitors, lithium-ion batteries, infrared photodetectors, electrochemical sensors, and gas sensors. They can also be applied to improve adhesion of comparatively thick copper coatings for ceramic PCB metallization. Here, we report the results of CuxOydeposition on alumina substrates in a hot-target HiPIMS discharge. The experiments were carried out in a magnetron deposition facility with thermally insulated copper target. CuxOy films with thickness around 2–3 μm were prepared. Their structure was studied with scanning electron microscope, and the composition was measured by EDS and XRD methods. The results showed predominant growth of stoichiometric CuO films. The correlations between deposition parameters and coating characteristics are discussed.