Transient thermal network model identification for power module packages-Reference-Cited by-同舟云学术

Transient thermal network model identification for power module packages

Published:2020 Issue:2 Volume:11 Page:157-169
ISSN:2185-4106
Container-title:Nonlinear Theory and Its Applications, IEICE
language:en
Short-container-title:NOLTA

Author:

Fukunaga Shuhei¹^ORCID,Funaki Tsuyoshi¹^ORCID

Affiliation:

1. Osaka Univ., Div. of Electrical, Electronic and Information Eng., Graduate school of Eng.

Publisher

Institute of Electronics, Information and Communications Engineers (IEICE)

Subject

Rehabilitation,Physical Therapy, Sports Therapy and Rehabilitation,General Medicine

Link

https://www.jstage.jst.go.jp/article/nolta/11/2/11_157/_pdf

Reference29 articles.

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2. [2] T. Funaki and H. Inoue, et al., “Characterization of SiC power module for high switching frequency operation,” IEICE Electronics Express, vol. 7, no. 14, pp. 1008-1013, July 2010.

3. [3] J. Millam and P. Godignon, et al., “A survey of wide bandgap power semiconductor devices,” IEEE Transactions on Power Electronics, vol. 29, no. 5, pp. 2155-2163, May 2014.

4. [4] H.A. Mantooth and M.D. Glover, et al., “Wide bandgap technologies and their implications on miniaturizing power electronic systems,” IEEE Journal of Emerging and Selected Topics in Power Electronics, vol. 2, no. 3, pp. 374-385, September 2014.

5. [5] T. Kimoto and J.A. Cooper, Fundamentals of silicon carbide technology: Growth, characterization, devices, and applications, Wiley-IEEE Press, November 2014.

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