An optimization method for conformal shielding-Reference-Cited by-同舟云学术

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An optimization method for conformal shielding

Published:2021-05-10 Issue:9 Volume:18 Page:20210022-20210022
ISSN:1349-2543
Container-title:IEICE Electronics Express
language:en
Short-container-title:IEICE Electron. Express

Author:

Yuan Jian¹,Li Jun²,Cao Jia³,Chen Pengwei³,Cao Liqiang⁴,Ye Tianchun⁴

Affiliation:

1. Department of Microelectronic, University of Science and Technology of China

2. Microsystem Packaging Research Center, Institute of Microelectronics of Chinese Academy of Sciences

3. Beijing Institute of Radio Measurement

4. Institute of Microelectronics of Chinese Academy of Sciences

Publisher

Institute of Electronics, Information and Communications Engineers (IEICE)

Subject

Electrical and Electronic Engineering,Condensed Matter Physics,Electronic, Optical and Magnetic Materials

Link

https://www.jstage.jst.go.jp/article/elex/18/9/18_18.20210022/_pdf

Reference34 articles.

1. [1] Y. He, et al.: “Study on a conformal shielding structure with conductive adhesive coated on molding compound in 3-D packages,” IEEE Trans. Electromagn. Compat. 58 (2016) 442 (DOI: 10.1109/TEMC.2015.2503729).

2. [2] A.O. Watanabe, et al.: “Highly-effective integrated EMI shields with graphene and nanomagnetic multilayered composites,” IEEE 66th Electronic Components and Technology Conference (ECTC) (2016) 206 (DOI: 10.1109/ECTC.2016.294).

3. [3] K. Song, et al.: “Measurement, simulation and mathematical estimation of magnetic field shielding effectiveness of sputtered shielding materials using spiral coils,” IEEE Symposium on Electromagnetic Compatibility, Signal Integrity and Power Integrity (EMC, SI & PI) (2018) 47 (DOI: 10.1109/EMCSI.2018.8495438).

4. [4] F. Jiang, et al.: “Research on conformal EMI shielding Cu/Ni layers on package,” 15th International Conference on Electronic Packaging Technology (ICEPT) (2014) 227 (DOI: 10.1109/ICEPT.2014.6922642).

5. [5] N. Karim, et al.: “Improving electromagnetic compatibility performance of packages and SiP modules using a conformal shielding solution,” Asia-Pacific International Symposium on Electromagnetic Compatibility (2010) 56 (DOI: 10.1109/APEMC.2010.5475724).

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