Impact of ground solder ball failure in BGA package on near electric field radiation-Reference-Cited by-同舟云学术

Impact of ground solder ball failure in BGA package on near electric field radiation

Author:

Yuan Yidong¹,Zhang Tianmeng²,Wang Ziren³,Song Kaixuan²,Bi Lingyu²,Tian Lu¹,Gao Jinchun²

Affiliation:

1. Beijing Smart-chip Microelectronics Technology Co., Ltd.

2. Beijing Key Laboratory of Work Safety Intelligent Monitoring, School of Electronic Engineering, Beijing University of Posts and Telecommunications

3. China Telecommunication Technology Labs, China Academy of Information and Communications Technology

Publisher

Institute of Electronics, Information and Communications Engineers (IEICE)

Subject

Electrical and Electronic Engineering,Condensed Matter Physics,Electronic, Optical and Magnetic Materials

Link

Reference32 articles.

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1. Study on the Ball Grid Array Connection Failure Effects on Near Magnetic Field Radiation;2023 IEEE 7th International Symposium on Electromagnetic Compatibility (ISEMC);2023-10-20