Impact of ground solder ball failure in BGA package on near electric field radiation

Author:

Yuan Yidong1,Zhang Tianmeng2,Wang Ziren3,Song Kaixuan2,Bi Lingyu2,Tian Lu1,Gao Jinchun2

Affiliation:

1. Beijing Smart-chip Microelectronics Technology Co., Ltd.

2. Beijing Key Laboratory of Work Safety Intelligent Monitoring, School of Electronic Engineering, Beijing University of Posts and Telecommunications

3. China Telecommunication Technology Labs, China Academy of Information and Communications Technology

Publisher

Institute of Electronics, Information and Communications Engineers (IEICE)

Subject

Electrical and Electronic Engineering,Condensed Matter Physics,Electronic, Optical and Magnetic Materials

Cited by 2 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献

1. Study on the Ball Grid Array Connection Failure Effects on Near Magnetic Field Radiation;2023 IEEE 7th International Symposium on Electromagnetic Compatibility (ISEMC);2023-10-20

2. Impact of impedance compensation structure in coaxial‐microstrip transition section on near‐field radiation;Microwave and Optical Technology Letters;2023-07-12

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