A 125–170 GHz wideband high-power amplifier using 0.5-µm InP DHBT
Author:
Affiliation:
1. Fundamental Science on EHF Laboratory, University of Electronic Science and Technology of China
2. Science and Technology on Monolithic Integrated Circuits and Modules Laboratory, Nanjing Electronic Devices Institute
Publisher
Institute of Electronics, Information and Communications Engineers (IEICE)
Subject
Electrical and Electronic Engineering,Condensed Matter Physics,Electronic, Optical and Magnetic Materials
Link
https://www.jstage.jst.go.jp/article/elex/14/16/14_14.20170684/_pdf
Reference13 articles.
1. [1] K. Schmalzet al.: “A subharmonic receiver in SiGe technology for 122 GHz sensor applications,” IEEE J. Solid-State Circuits 45 (2010) 1644 (DOI: 10.1109/JSSC.2010.2051474).
2. [2] H.-J. Songet al.: “Present and future of terahertz communications,” IEEE Trans. THz Sci. Technol. 1 (2011) 256 (DOI: 10.1109/TTHZ.2011.2159552).
3. [3] Z. Xuet al.: “A 100–117 GHz W-band CMOS power amplifier with on-chip adaptive biasing,” IEEE Microw. Wireless Compon. Lett. 21 (2011) 547 (DOI: 10.1109/LMWC.2011.2163815).
4. [4] N. Sarmahet al.: “160-GHz power amplifier design in advanced SiGe HBT technologies with Psat in excess of 10 dBm,” IEEE Trans. Microw. Theory Techn. 61 (2013) 939 (DOI: 10.1109/TMTT.2012.2231875).
5. [5] R. B. Yishay, et al.: “A 17.8 dBm 110–130 GHz power amplifier and doubler chain in SiGe BiCMOS technology,” IEEE Radio Freq. Integr. Circuits Symp. Dig. (2015) 391 (DOI: 10.1109/RFIC.2015.7337787).
Cited by 2 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献
1. A terahertz on-chip InP-based power combiner designed using coupled-grounded coplanar waveguide lines*;Chinese Physics B;2021-12-01
2. A 220-GHz InP DHBT Power Amplifier With Integrated Planar Spatial Power Combiner;IEEE Microwave and Wireless Components Letters;2019-03
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