Multi-Stage Contour Primitive of Interest Extraction Network with Dense Direction Classification-Reference-Cited by-同舟云学术

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Multi-Stage Contour Primitive of Interest Extraction Network with Dense Direction Classification

Published:2022-10-01 Issue:10 Volume:E105.D Page:1743-1750
ISSN:0916-8532
Container-title:IEICE Transactions on Information and Systems
language:en
Short-container-title:IEICE Trans. Inf. & Syst.

Author:

LU Jinyan¹,HUANG Quanzhen¹,LIU Shoubing¹

Affiliation:

1. School of Electrical Information Engineering, Henan University of Engineering

Publisher

Institute of Electronics, Information and Communications Engineers (IEICE)

Subject

Artificial Intelligence,Electrical and Electronic Engineering,Computer Vision and Pattern Recognition,Hardware and Architecture,Software

Link

https://www.jstage.jst.go.jp/article/transinf/E105.D/10/E105.D_2022EDP7031/_pdf

Reference27 articles.

1. [1] J.C. Yang, C.G. Wang, B. Jiang, H. Song, and Q. Meng, “Visual perception enabled industry intelligence: state of the art, challenges and prospects,” IEEE Trans. Ind. Informat., vol.17, no.3, pp.2204-2219, 2021. 10.1109/tii.2020.2998818

2. [2] M. Pfanne, M. Chalon, F. Stulp, and A. Albu-Schaffer, “Fusing joint measurements and visual features for in-hand object pose estimation,” IEEE Robotics and Automation Letters, vol.3, no.4, pp.3497-3504, 2018. 10.1109/lra.2018.2853652

3. [3] L. Lecrosnier, R. Boutteau, P. Vasseur, X. Savatier, and F.Fraundorfer, “Camera pose estimation based on PnL with a known vertical direction,” IEEE Robotics and Automation Letters, vol.4, no.4, pp.3852-3859, 2019. 10.1109/lra.2019.2929982

4. [4] Y.B. Miao, L.L. Huang, and S.A. Zhang, “A two-step phenotypic parameter measurement strategy for overlapped grapes under different light conditions,” Sensors, vol.21, no.13, p.4532. 2021. 10.3390/s21134532

5. [5] J.Q. Peng, W.F. Xu, L. Yan, E. Pan, B. Liang, and A.-G. Wu, “A pose measurement method of a space noncooperative target based on maximum outer contour Recognition,” IEEE Trans. Aerosp. Electron. Syst., vol.56, no.1, pp.512-526, 2020. 10.1109/taes.2019.2914536

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