Modeling and simulation research on conducted immunity of power module of digital control circuit based on transient EMI
Author:
Affiliation:
1. Research Center for Electromagnetic Environmental Effects, Southeast University Nanjing
2. Zhengzhou Institute of Mechanical and Electrical Engineering
Publisher
Institute of Electronics, Information and Communications Engineers (IEICE)
Link
https://www.jstage.jst.go.jp/article/elex/21/6/21_21.20230573/_pdf
Reference31 articles.
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3. [3] K.-J. Li, et al.: “Bayesian inference for susceptibility of electronics to transient electromagnetic disturbances with failure mechanism consideration,” IEEE Trans. Electromagn. Compat. 62 (2020) 1669 (DOI: 10.1109/TEMC.2019.2925712).
4. [4] J.-J. Laurin, et al.: “On the prediction of digital circuit susceptibility to radiated EMI,” IEEE Trans. Electromagn. Compat. 37 (1995) 528 (DOI: 10.1109/15.477337).
5. [5] N. Lambrecht, et al.: “A circuit modeling technique for the ISO 7637-3 capacitive coupling clamp test,” IEEE Trans. Electromagn. Compat. 60 (2018) 858 (DOI: 10.1109/TEMC.2017.2765690).
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