Device Modeling Techniques for High-Frequency Circuits Design Using Bond-Based Design at over 100 GHz
Author:
Affiliation:
1. ELP R&D Dept. Semiconductor Technology Academic Research Center (STARC)
2. Graduate School of Engineering, The University of Tokyo
3. Graduate School of Advanced Sciences of Matter, Hiroshima University
Publisher
Institute of Electronics, Information and Communications Engineers (IEICE)
Subject
Electrical and Electronic Engineering,Electronic, Optical and Magnetic Materials
Link
http://www.jstage.jst.go.jp/article/transele/E94.C/4/E94.C_4_589/_pdf
Reference16 articles.
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2. [2] W.L. Chan, J.R. Long, M. Spirito, and J.J. Pekarik, “A 60GHz-Band 2 × 2 phased-array transmitter in 65nm CMOS,” ISSCC 2010, 2.3, pp.42-43, 2010.
3. [3] F. Vecchi, S. Bozzola, M. Pozzoni, D. Guermandi, E. Temporiti, M. Repossi, U. Decanis, A. Mazzanti, and F. Svelto, “A wideband mm-wave CMOS receiver for Gb/s communications employing interstage coupled resonators,” ISSCC 2010, pp.220-221, 2010.
4. [4] A. Oncu and M. Fujishima, “19.2mW 2Gbps CMOS pulse receiver for 60GHz band wireless communication,” 2008 VLSI Circuits, pp.158-159, 2008.
5. [5] A. Oncu, S. Ohashi, K. Takano, T. Takada, J. Shimizu, and M. Fujishima, “1Gbps/ch 60GHz CMOS multichannel millimeter-wave repeater,” 2010 VLSI Circuits, pp.93-94, 2010.
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